ASRock B560M-HDV/M.2 | Intel 11th & 10th Gen Micro-ATX Motherboard with DDR4, PCIe 4.0 & M.2 NVMe


The ASRock B560M-HDV/M.2 is a Micro-ATX motherboard with Intel B560 chipset, supporting 11th and 10th Gen Intel Core processors, DDR4 memory, PCIe 4.0 graphics, and M.2 NVMe storage.

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The ASRock B560M-HDV/M.2 is a compact Micro-ATX motherboard built with the Intel B560 chipset, offering reliable performance for 11th Gen (Rocket Lake) and 10th Gen (Comet Lake) Intel Core processors on the LGA 1200 socket. Designed to balance performance and affordability, it supports DDR4 memory, PCIe 4.0 graphics cards, and M.2 NVMe SSDs for fast and efficient storage.

With its Micro-ATX form factor, the B560M-HDV/M.2 is ideal for smaller PC builds without sacrificing essential features. It includes SATA3 connectivity, stable power delivery, and Gigabit LAN for smooth networking, making it a solid choice for both gaming and productivity.

Whether you’re building an entry-level gaming PC or a home/office system, the ASRock B560M-HDV/M.2 delivers dependable performance and expandability at great value.

🔹 Key Specifications:

  • Brand: ASRock

  • Model: B560M-HDV/M.2

  • Chipset: Intel B560

  • Form Factor: Micro-ATX

  • CPU Support: Intel 11th & 10th Gen Core, Pentium, and Celeron (LGA 1200)

  • Memory: DDR4 support (Dual Channel)

  • Expansion: PCIe 4.0 x16 slot + PCIe 3.0 slots

  • Storage: M.2 NVMe SSD + SATA3

  • Networking: Gigabit LAN (Ethernet)

  • Features: PCIe 4.0 GPU compatibility, DDR4 memory support, compact Micro-ATX design, M.2 NVMe storage slot

  • Best For: Budget gaming PCs, office desktops, compact Intel builds

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Brand

ASRock

ASRock Inc. is established in 2002, specialized in the field of motherboards. ASRock strives to build up its own brand. With the 3C design concept, “Creativity, Consideration, Cost-effectiveness”, the company explores the limit of motherboards manufacturing while paying attention on the eco issue at the same time, developing products with the consideration of eco-friendly concept.

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